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Enterprise Open Source Hardware Platform
1 Years
| Ask Lasest Price | |
| Brand Name : | Neardi |
| Model Number : | LCB3588S |
| Price : | Negotiable |
| Payment Terms : | L/C,D/A,D/P,T/T |
| Supply Ability : | 10000/pieces/mon |
| Delivery Time : | 7 days |
LCB3588S Android System On Module SoM With PCB Interface 10 Layers
The LCB3588S core module, built on the Rockchip RK3588S platform, is a high-performance, all-in-one solution designed for demanding applications. Measuring just 75mm × 70mm, it features two 140Pin board-to-board connectors (0.8mm pitch) and four 30Pin FPC connectors (0.5mm pitch), secured with four M2 screws. This design ensures full access to RK3588S pin signals while maintaining high reliability, cost-effectiveness, and flexibility. For industrial and long-term vibration-prone environments, the FPC connectors can be added as needed, providing greater durability and stability compared to card-edge or smaller-pitch connectors.
Equipped with the RK3588S CPU, the LCB3588S supports LPDDR4/LPDDR4X memory in 2GB, 4GB, 8GB, and 16GB configurations. It also integrates high-speed eMMC 5.1 storage options of 32GB, 64GB, and 128GB. The module includes a power management unit (PMU) with the RK806 and multiple DC-DC and LDO components, while the CPU core voltages support Dynamic Voltage and Frequency Scaling (DVFS) for optimized power efficiency.
Designed as a full-featured system-on-module (SoM), the LCB3588S fully exposes and verifies all CPU functional pins, ensuring reliability and seamless integration. Its modular design helps developers accelerate product development, reduce costs, and improve overall efficiency.
Key Features:
• Compact, high-performance system-on-module (SoM)
• Powered by Rockchip RK3588S for advanced computing
• Flexible memory options: LPDDR4/LPDDR4X up to 16GB
• High-speed eMMC 5.1 storage up to 128GB
• Robust power management with RK806 PMU
• Reliable connectivity with board-to-board and FPC connectors
• Enhanced stability for industrial and vibration-prone environments
• Optimized power efficiency with DVFS support
• Cost-effective and scalable for various applications
• Ideal for embedded computing and AI-driven solutions
| Function | Description |
| CPU | RK3588S 8nm; 8-core 64-bit processor architecture (4A76 + 4A55) |
| GPU | ARM Mali-G610 MC4; Supports OpenGL ES 1.1/2.0/3.1/3.2; Vulkan
1.1/1.2; OpenCL 1.1/1.23/2.0; High-performance 2D image acceleration module. |
| NPU | 6TOPS computing power / 3-core architecture; Supports int4/int8/int16/FP16/BF16/TF32. |
| VPU | Supports H.265/H.264/AV1/VP9/AVS2 video decoding, up to 8K60FPS; Supports H.264/H.265 video encoding, up to 8K30FPS. |
| DDR | LPDDR4, with options for 4GB/8GB/16GB. |
| eMMC | eMMC 5.1, with options for 32GB/64GB/128 GB. |
| PMU | RK806 |
| OS | Android / Ubuntu / Buildroot / Debian |
| Video Input Interface | MIPI interface : 2*MIPI-CSI DPHY 4L / CPHY 3L 2*MIPI-CSI DPHY 2L HDMI RX interface: HDMI 2.0 2160p@60 Hz, Support HDCP2.3 and HDCP1.4; |
| Video Output Interface | 1 * HDMI2.1 up to 8K@60fps; 1 * HDMI2.0 up to 4K@60fps; 2 * MIPI-DSI up to 4K@60fps; 1 * BT.1120 up to 1080@60fps; |
| Image Signal Processor | 8064*6048@15 dual ISP; 6528*4898@30 dual ISP; 4672*3504@30 single ISP; |
| Video Output Processor | Video Port0 up to 7680*4320@60Hz; Video Port1 up to 4096*4320@60Hz; |
| Operating temperature | Enterprise Grade: -20°C to 70°C |
| PCB interface | B2B(280 Pin 0.8mm Pitch) + FPC(2 * 30 Pin 0.5mm Pitch) |
| PCB layers | 10 layers |
| PCB size | L* W *H(mm):75 *70 * 7.5(PCB thickness 1.6mm) |
Our System On Module (SoM) product comes with comprehensive technical support and services to ensure that our customers have a seamless experience with our product. Our team of engineers is available to provide assistance with hardware and software integration, customization, and optimization. We also provide documentation and training to help our customers get the most out of their SoM product. Additionally, we offer post-sale support, including repairs and replacements, to ensure that our customers' products continue to function properly. Our goal is to provide excellent customer service and support to help our customers succeed in their projects.
Product Packaging:
The System On Module (SoM) product will be packaged in a sturdy cardboard box with ample cushioning material to prevent any damage during transit. The box will be labeled with the product name, model number, and a brief description of the contents.
Shipping:
The SoM product will be shipped via a reputable courier service such as FedEx, DHL, or UPS. The shipping costs will be calculated based on the weight and destination of the package. Customers will receive a tracking number via email once the package has been shipped.
Q1. Where is the System On Module (SoM) product manufactured?
A1. Our SoM product is manufactured in Shanghai, China.
Q2. What is the minimum order quantity for purchasing the System On Module (SoM) product?
A2. The minimum order quantity for purchasing our SoM product is 1 piece.
Q3. What are the available payment terms for purchasing the System On Module (SoM) product?
A3. We accept L/C, D/A, D/P, and T/T as payment terms for purchasing our SoM product.
Q4. What is the delivery time for the System On Module (SoM) product?
A4. The delivery time for our SoM product is 7 days.
Q5. What is the packaging dimension for the System On Module (SoM) product?
A5. The packaging dimension for our SoM product is 33.5×19×9 cm.
Q6. Is the price of the System On Module (SoM) product negotiable?
A6. Yes, the price of our SoM product is negotiable.
Q7. What is the supply ability for the System On Module (SoM) product?
A7. The supply ability for our SoM product is 10000 pieces per month.
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