Product Description:
The LCB3568 is a compact yet powerful core module built on the
Rockchip RK3568 series chip platform, including the RK3568 and
RK3568J variants. Measuring just 60mm x 40mm, it connects to the
baseboard via four dual-slot 0.5mm pitch 80Pin board-to-board
connectors, secured with four M2 screws for enhanced stability and
reliability, ensuring effortless installation and maintenance.
Equipped with a CPU, DDR, eMMC, and PMU, the module offers flexible
performance options. The CPU is either the RK3568 or RK3568J. It
features LPDDR4 memory (available in 1GB, 2GB, or 4GB
configurations) for low power consumption and high frequency, and
high-speed eMMC 5.1 storage ranging from 4GB to 128GB. The PMU
integrates the RK809 and advanced DC-DC and LDO components,
supporting DVFS for efficient power management.
With a modular design approach, the LCB3568 exposes all CPU
functional pins, thoroughly tested and validated for mass
production. This design simplifies product development, reduces
costs, and accelerates time-to-market, making it an ideal choice
for industrial applications.
Technical Parameters:
| Function | Description | | CPU | RK3568, 22nm process, quad-core 64-bit Cortex-A55, with a maximum
clock speed of 2.0GHz. | | GPU | ARM G52 2EE, supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan
1.1, and has a high-quality 2D graphics engine built-in. | | NPU | Offers up to 1 TOPS of computational power; supports hybrid
operations of
INT8/INT16/FP16/BFP16 MAC; compatible with deep-learning frameworks
such as TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras,
and Darknet. | | VPU | Capable of 4K VP9 and 4K H265 video decoding at up to 60fps. Capable of 1080P H265/H264 video encoding at up to 100fps. Equipped with an 8M ISP with HDR capabilities. | | DDR | LPDDR4 RAM, with options for 1GB/2GB/4GB/8GB (Optional). | | eMMC | eMMC 5.1 storage, with options for 8GB/16GB/32GB/64GB/128GB
(Optional). | | PMU | RK806 | | OS | Android / Ubuntu / Buildroot / Debian | | Camera Interface | Compatible with the MIPI Alliance Interface specification v1.2
Up to 4 data lanes, 2.5Gbps maximum data rate per lane
One interface with 1 clock lane and 4 data lanes
Two interface, each with 1 clock lane and 2 data lanes
Support up to 16bit DVP interface (digital parallel input)
Support ISP block(Image Signal Processor) | | Display Interface | RGB/ BT656/BT1120/ MIPI_DSI_V1.2/ LVDS/ HDMI2.0/Edp1.3/ EBC
Support three simultaneous displays
HDR10/HDR HLG/ HDR2SDR/SDR2HDR
3D-LUT/P2I/CSC/BCSH/DITHER/CABC/GAMMA/COLOR BAR | | USB Interface | 1 x USB3.0 HOST, 1 x USB3.0 OTG, 2 x USB2.0 HOST | | PCIe3.0 PHY Interface | Support PCIe3.1(8Gbps) protocol and backward compatible with the
PCIe2.1 and PCIe1.1 protocol
Support two lane
Support two PCIe controller with x1 mode or one PCIe controller
with x2 mode
Dual operation mode: Root Complex(RC)and End Point(EP) | | Multi-PHY Interface | Support three multi-PHYs with PCIe2.1/SATA3.0/USB3.0/QSGMII
controller
USB3 Host controller + USB3 OTG controller
PCIe2.1 controller / three SATA controller | | Audio Interface | I2S0 with 8 channel TX and RX
I2S1 with 8 channel TX and RX
I2S2/I2S3 with 2 channel TX and RX
PDM with 8channel
TDM supports up to 8 channels for TX and 8 channels RX path | | Connectivity | Compatible with SDIO 3.0 protocol
GMAC 10/100/1000M Ethernet Controller
Four on-chip SPI controllers
Ten on-chip UART controllers inside
Six on-chip I2C controllers
Smart Card with ISO-7816
Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation
Multiple groups of GPIO
8 single-ended input channels SARADC with 10bits resolution up to
1MS/s
sampling rate | | Operating temperature | Enterprise Grade: -20°C to 70°C
Industrial Grade: -40°C to 85°C | | PCB interface | B2B,320 Pin | | PCB layers | 10 layers | | PCB size | L* W *H(mm):60 *40 * 7.8(PCB thickness 1.6mm) |
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Support and Services:
Our SBC product technical support and services include:
- Hardware and software design support
- Customization services based on customer requirements
- Technical consultation and guidance on SoM integration
- Documentation and reference design materials
- Testing and validation services
- Product life cycle management and support
Packing and Shipping:
Product Packaging for System On Module SoM:
- The Product will be packaged in an anti-static bag to prevent any damage
during transportation.
- The anti-static bag will then be placed in a cardboard box with
adequate padding to prevent any damage during shipping.
- The cardboard box will have a label indicating the product name,
quantity, and any other relevant information.
Shipping Information:
- The shipping method will be chosen by the customer at the time of
purchase.
- We offer worldwide shipping to all countries.
- Shipping costs will be calculated based on the customer's location
and the chosen shipping method.
- The estimated shipping time will be provided to the customer at the
time of purchase.
